entsply Sirona D Orthophos E 2D Technical Specifications
2D
Product
Dentsply Sirona ORTHOPHOS E
Sensor type and dimensions
Csl sensor
Kinematics (sensing method)
Multi–motor
Exposure time (PAN and CEPH)
Max. 14.2 sec
Dynamic Range
16 bit
Upgrade to Ceph
YES (left)
Sensor for Ceph
Optional
TWAIN compatibility
NO
Function
Panoramic, Extraoral Bitewing, TMJ
Multi size option of Ceph (DxHcm)
NO
3D Upgradability
NO
Sensor Pixel Size
–
Focal Spot
0.5 mm
kV
60–90 kV
mA
3–16 mA
Dimension
160.02 cm×160.02 cm×226.06 cm
Weight
119.99 kg
SW
Sidexis 4
More information
Important 2D programs for basic diagnostics in 2D, MultiPad control panel, Sidexis 4 software
2D
entsply Sirona D Orthophos S 2D Technical Specifications
2D
Product
Dentsply Sirona ORTHOPHOS S 2D
Sensor type and dimensions
CsI cmOS sensor; active area: 145.15×6.48 mm
Kinematics (sensing method)
Multi–motor
Exposure time (PAN and CEPH)
Pano: 14.2 sec Ceph: 9.4 sec
Dynamic Range
16 bit
Upgrade to Ceph
YES
Sensor for Ceph
Standalone CCD, 230×6,48 mm
TWAIN compatibility
YES
Function
Panoramic, Extraoral Bitewing, TMJ
Multi size option of Ceph (DxHcm)
–
3D Upgradability
YES
Sensor Pixel Size
–
Focal Spot
0.5 mm
kV
60–90 kV
mA
3–16 mA
Dimension
127 cm×139.7 cm×226.06 cm
Weight
110 kg
SW
Sidexis 4
More information
It uses "Sharp Layer" (autofocus) technology, which takes several thousand images in a single exposure and automatically selects the layer with the best sharpness for each area. Each PAN image is thus optimally in focus. Upgradeable to 3D and interfacable with CEREC.
2D
entsply Sirona D Orthophos SL 2D Technical Specifications
2D
Product
Dentsply Sirona ORTHOPHOS SL 2D
Sensor type and dimensions
CdTe 146×6 mm with DCS (direct conversion of X–rays to electrical signal)
Kinematics (sensing method)
Multi–motor
Exposure time (PAN and CEPH)
Pano Standard: 14 sec Ceph Standard: 9,4 sec
Dynamic Range
16 bit
Upgrade to Ceph
YES
Sensor for Ceph
Standalone CCD 230×6,48 mm
TWAIN compatibility
YES
Function
Panoramic, Extraoral Bitewing, TMJ
Multi size option of Ceph (DxHcm)
–
3D Upgradability
YES
Sensor Pixel Size
–
Focal Spot
0.5 mm
kV
60–90 kV
mA
3–16 mA
Dimension
127 cm×139.7 cm×226.06 cm
Weight
110 kg
SW
Sidexis 4
More information
21 programs, Sharp Layer (SL) technology - change focus area in SIDEXIS 4, upgradeable to 3D up to 11×10 cm FOV
2D
Dentsply Sirona Axeos 3D
Technical Specifications
3D
Product
Dentsply Sirona Axeos 3D
Functions (Device Type)
Hybrid system
Voxel size
0.08 mm
Focal Spot Size
–
FOV size without stitching
5×5.5; 8×8; 11×10; 17×13 cm
FOV size with stitching
–
Scan Time / Exposure Time
Pano: 14.2 sec 3D exposure: 15–60 sec depending on computer power
Image data processing time
–
Dynamic range
–
Upgrade to Ceph
YES
Sensor for Ceph
Standalone
Patient position
Standing, seated
Warranty
–
Panoramic type
Real Panoramic Sensor
kV
60–90 kV
mA
3–16 mA
Dimension
141.09 cm×215.49 cm×224.99 cm
Weight
110.22 kg (without Ceph) 132.44 kg (with Ceph)
SW
Sidexis 4
More information
Two-sensor model. Low dose function. HD function for high image quality with up to 80 μm resolution. DCS (direct image conversion) technology. Autofocus. Interfaces to the CEREC CAD/CAM system.
3D
Dentsply Sirona Orthophos SL 3D Technical Specifications
3D
Product
Dentsply Sirona ORTHOPHOS SL 3D
Functions (Device Type)
Hybrid system
Voxel size
0.16 mm; 0.08 mm in HD
Focal Spot Size
0.5 mm
FOV size without stitching
5×5.5; 8×8; 11×10 cm
FOV size with stitching
–
Scan Time / Exposure Time
Pano: 14.2 sec
Image data processing time
4.5 min
Dynamic range
16 bit
Upgrade to Ceph
YES
Sensor for Ceph
Standalone CCD 230×6,48 mm
Patient position
Standing, seated
Warranty
5 year bumper to bumper
Panoramic type
Real Panoramic Sensor
kV
60–90 kV
mA
3–16 mA
Dimension
141.09 cm×215.49 cm×224.99 cm
Weight
110 kg
SW
SIDEXIS XG / GALAXIS
More information
3D sensor type and size: flat panel 16×16 cm with Si (amorphous silicon) technology. Quickshot mode; the device allows interfacing with the CEREC CAD/CAM system and production of individual implant templates
3D
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