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Jan. 2012
DDR3 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2012 Samsung Electronics Co., Ltd. All rights reserved.
-1-
Jan. 2012
Product Guide
DDR3 SDRAM Memory
1. DDR3 SDRAM MEMORY ORDERING INFORMATION 1
2
3
4
5
6
7
8
9
10
11
K 4 B X X X X X X X - X X X X Speed
SAMSUNG Memory DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V)
2. DRAM : 4 8. Revision M A B C D E F G H
3. DRAM Type B : DDR3 SDRAM
4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb
: 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen. : 8th Gen. : 9th Gen.
9. Package Type Z H J M B
5. Bit Organization 04 : x 4 08 : x 8 16 : x16
: : : : :
FBGA (Lead-free) FBGA (Halogen-free & Lead-free) FBGA (Lead-free, DDP) FBGA (Halogen-free & Lead-free, DDP) FBGA (Halogen-free & Lead-free, Flip Chip)
10. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power(1.5V) Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks
11. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 MA : DDR3-1866
-2-
(400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) (933MHz @ CL=13, tRCD=13, tRP=13)
Jan. 2012
Product Guide
DDR3 SDRAM Memory
2. DDR3 SDRAM Component Product Guide Density
1Gb G-die
2Gb C-die
2Gb D-die
2Gb E-die
4Gb A-die
4Gb B-die
4Gb C-die
DDP 4Gb D-die
DDP 8G B-die
Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
Part Number
Package & Power, Temp. & Speed
Org.
K4B1G0446G
BCF8/H9/K0/MA
256M x 4
K4B1G0846G
BCF8/H9/K0/MA
128M x 8
K4B1G0446G
BYF8/H9/K0
256M x 4
K4B1G0846G
BYF8/H9/K0
128M x 8
K4B2G0446C
HCF8/H9/K0
512M x 4
K4B2G0846C
HCF8/H9/K0
256M x 8
K4B2G0446C
HYF8/H9
512M x 4
K4B2G0846C
HYF8/H9
256M x 8
K4B2G0446D
HCF8/H9/K0/MA
512M x 4
K4B2G0846D
HCF8/H9/K0/MA
256M x 8
K4B2G0446D
HYF8/H9/K0
512M x 4
K4B2G0846D
HYF8/H9/K0
256M x 8
K4B2G0446E
BCH9/K0/MA
512M x 4
K4B2G0846E
BCH9/K0/MA
256M x 8
K4B2G0446E
BYH9/K0
512M x 4
K4B2G0846E
BYH9/K0
256M x 8
K4B4G0446A
HCF8/H9/K0
1G x 4
K4B4G0846A
HCF8/H9/K0
512M x 8
K4B4G0446A
HYF8/H9/K0
1G x 4
K4B4G0846A
HYF8/H9/K0
512M x 8
K4B4G0446B
HCF8/H9/K0/MA
1G x 4
K4B4G0846B
HCF8/H9/K0/MA
512M x 8
K4B4G0446B
HYF8/H9/K0
1G x 4 512M x 8
K4B4G0846B
HYF8/H9/K0
K4B4G0446C
HCH9/K0/MA
1G x 4
K4B4G0846C
HCH9/K0/MA
512M x 8
K4B4G0446C
HYH9/K0
1G x 4
K4B4G0846C
HYH9/K0
512M x 8
K4B4G0446D
MCF8/H9
1G x 4
K4B4G0846D
MCF8/H9
512M x 8
K4B4G0446D
MYF8/H9
1G x 4
K4B4G0846D
MYF8/H9
512M x 8
K4B8G0446B
MCF8/H9
2G x 4
K4B8G0846B
MCF8/H9
1G x 8
K4B8G0446B
MYF8/H9
2G x 4
VDD Voltage1
Now
78 ball FBGA
Now
78 ball FBGA
Now
78 ball FBGA
Nov’11
1.5V
1.35V
1.5V
1.35V
1.5V
1.35V
1.5V
78 ball FBGA
Now
78 ball FBGA
Now
1.35V
1.5V
1.35V
1.5V 78 ball FBGA
Jun’12
78 ball FBGA
Now
78 ball FBGA
Now
78 ball FBGA
Now
1.35V
1.5V
1.35V
1.5V
1.35V
MYF8/H9
1Gx 8
MYH9/K0
256M x 32
1.5V
K4B8G3346B
MYH9/K0
256M x 32
1.35V
-3-
78 ball FBGA 1.35V
K4B8G3346B
1. 1.35V product is 1.5V operatable.
Avail.
1.5V
K4B8G0846B
* NOTE
PKG
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
3. DDR3 SDRAM Module Ordering Information 1
2
3
4
5
6
7
8
9
10
11
131
12
M X X X B X X X X X X X - X X X X Memory Module DIMM Type Data bits
Memory Buffer Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization 1. Memory Module : M
8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen.
2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 71 : 74 : 78 : 86 : 90 : 91 : 92 :
x64 x72 x64 x72 x72 x72 x72
204pin Unbuffered SODIMM 204pin ECC Unbuffered SODIMM 240pin Unbuffered DIMM 240pin LR DIMM 240pin VLP Unbuffered DIMM 240pin ECC Unbuffered DIMM 240pin VLP Registered DIMM
33 : 32M (for 128Mb/512Mb) 65 : 64M (for 128Mb/512Mb) 29 : 128M (for 128Mb/512Mb) 57 : 256M (for 512Mb/2Gb) 52 : 512M (for 512Mb/2Gb) 1K : 1G (for 2Gb) 2K : 2G (for 2Gb)
2nd Gen. 4th Gen. 6th Gen. 8th Gen.
10. PCB Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev.
B : DDR3 SDRAM (1.5V VDD)
32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G: 1G 2G: 2G 4G: 4G
: : : :
9. Package Z : FBGA(Lead-free) H : FBGA(Lead-free & Halogen-free) J : FBGA(Lead-free, DDP) M : FBGA(Lead-free & Halogen-free, DDP) B : FBGA (Halogen-free & Lead-free, Flip Chip) E : FBGA(Lead-free & Halogen-free, QDP)
4. DRAM Component Type
5. Depth
A C E G
1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer
11. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power(1.5V) Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
2
12. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 MA: DDR3-1866
(400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) (933MHz @ CL=13, tRCD=13, tRP=13)
6. # of Banks in comp. & Interface 7 :
8Banks & SSTL-1.5V
13. Memory Buffer 0 1 8 9
7. Bit Organization 0 : x4 3 : x8 4 : x16
: : : :
Inphi iMB02-GS02A IDT MB3 B0 IDT AI (evergreen) Inphi UVGS02
NOTE: 1. Only used for LRDIMM 2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) PC3-14900(DDR3-1866)
-4-
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
1Gb
G-die
8
1
78 ball FBGA
30mm
Now
128M x 8 * 16 pcs
1Gb
G-die
8
2
256M x 8 * 8 pcs
2Gb
C-die
78 ball FBGA
30mm
256M x 8 * 8 pcs
2Gb
D-die
128M x 8 * 18 pcs
1Gb
G-die
256M x 8 * 9 pcs
2Gb
C-die
256M x 8 * 9 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
C-die
256M x 8 * 16 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
E-die
512M x 8 * 8 pcs
4Gb
C-die
256M x 8 * 18 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
D-die
Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 64
1GB
M378B2873GB0
CF8/H9/K0/MA
A(1Rx8)
128M x 8 * 8 pcs
1Gb
128Mx 72
1GB
M391B2873GB0
CF8/H9/K0/MA
D(1Rx8)
128M x 8 * 9 pcs
M378B5673GB0
CF8/H9/K0/MA
B(2Rx8)
256Mx 64
2GB
M378B5773CH0
CF8/H9/K0
M378B5773DH0
CF8/H9/K0/MA
M391B5673GH0
CF8/H9/K0/MA
M391B5773CH0
CF8/H9/K0
M391B5773DH0
CF8/H9/K0/MA
M378B5273CH0
CF8/H9/K0
M378B5273DH0
CF8/H9/K0/MA
256Mx 72
512Mx 64
512Mx 72
1Gx 64
1Gx 72
2GB
4GB
4GB
8GB
8GB
M378B5273EB0
CH9/K0
M378B5173CH0
CH9/K0/MA
M391B5273CH0
CF8/H9/K0
M391B5273DH0
CF8/H9/K0/MA
A(1Rx8) E(2Rx8) D(1Rx8)
B(2Rx8)
D(1Rx8)
E(2Rx8)
8
1
8
2
8
1
Now Now Now Now 78 ball FBGA
30mm
Now Now Now
8
2
8
1
8
2
78 ball FBGA
30mm
Now Nov’11 Jun’12 Now
78 ball FBGA
30mm
Now
M391B5273EB0
CH9
256M x 8 * 18 pcs
2Gb
E-die
Nov’11
M378B1G73AH0
CF8/H9/K0
512M x 8 * 16 pcs
4Gb
A-die
EOL Feb’12
512M x 8 * 16 pcs
4Gb
B-die
512M x 8 * 16 pcs
4Gb
C-die
512M x 8 * 18 pcs
4Gb
A-die
512M x 8 * 18 pcs
4Gb
B-die
512M x 8 * 18 pcs
4Gb
C-die
M378B1G73BH0 CF8/H9/K0/MA M378B1G73CH0
CH9/K0/MA
M391B1G73AH0
CF8/H9/K0
M391B1G73BH0 CF8/H9/K0/MA M391B1G73CH0
B(2Rx8)
E(2Rx8)
CH9/K0/MA
NOTE
8
2
78 ball FBGA
30mm
Now Jun’12 EOL Feb’12
8
2
78 ball FBGA
30mm
Now Jun’12
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
G-die
8
2
8
1
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M391B2873GB0
YF8/H9/K0
D(1Rx8)
128M x 8 * 9 pcs
1Gb
M391B5673GH0
YF8/H9/K0
E(2Rx8)
128M x 8 * 18 pcs
1Gb
256M x 8 * 9 pcs
2Gb
C-die
D(1Rx8)
256M x 8 * 9 pcs
2Gb
D-die
256Mx 72
512Mx 72
1Gx 72
2GB
4GB
8GB
M391B5773CH0
YF8/H9
M391B5773DH0
YF8/H9/K0
Composition
Comp. Version
Org.
Now 78 ball FBGA
30mm
Now Now
M391B5773EB0
YH9/K0
256M x 8 * 9 pcs
2Gb
E-die
Nov’11
M391B5273CH0
YF8/H9
256M x 8 * 18 pcs
2Gb
C-die
Now
M391B5273DH0
YF8/H9/K0
M391B5273EB0
YH9/K0
M391B5173CH0
YH9/K0
M391B1G73AH0
YF8/H9
M391B1G73BH0
YF8/H9/K0
M391B1G73CH0
YH9/K0
E(2Rx8)
D(1Rx8) E(2Rx8) E(2Rx8)
256M x 8 * 18 pcs
2Gb
D-die
256M x 8 * 18 pcs
2Gb
E-die
512M x 8 * 9 pcs
4Gb
C-die
512M x 8 * 18 pcs
4Gb
A-die
512M x 8 * 18 pcs
4Gb
B-die
512M x 8 * 18 pcs
4Gb
C-die
* NOTE : 1.35V product is 1.5V operatable.
-5-
8
8
8
2
78 ball FBGA
30mm
1
2
Now Nov’11 Jun’12
78 ball FBGA
EOL Feb’12 30mm
Now Jun’12
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.3 240Pin DDR3 VLP Unbuffered DIMM (1.35V Product) 240Pin DDR3 VLP Unbuffered DIMM Org.
Density
Part Number
Speed
Raw Card
Composition
256Mx 72
2GB
M390B5773DH0
YH9
J(1Rx8)
256M x 8 * 9pcs
512Mx 72
4GB
M390B5273DH0
YH9
K(2Rx8)
M390B5173BH0
YH9
J(1Rx8)
1Gx 72
8GB
M390B1G73BH0
YH9
K(2Rx8)
512M x 8 * 18 pcs
Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
8
1
78 ball FBGA
18.75mm
Now
78 ball FBGA
18.75mm
78 ball FBGA
18.75mm
2Gb
D-die
256M x 8 * 18 pcs
2Gb
D-die
8
2
256M x 8 * 18 pcs
2Gb
B-die
8
1
4Gb
B-die
8
2
NOTE
Now Now Now
4.4 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 64
1GB
M471B2873GB0
CF8/H9/K0/MA
B(1Rx8)
128M x 8 * 8 pcs
256Mx 64
512Mx 64
1Gx 64
2GB
4GB
8GB
M471B5673FH0
CF8/H9/K0
M471B5673GB0
CF8/H9/K0/MA
M471B5773CHS
CF8/H9/K0
M471B5773DH0
CF8/H9/K0/MA
F(2Rx8)
B(1Rx8)
Comp. Version 1Gb
G-die
128M x 8 * 16 pcs
1Gb
F-die
128M x 8 * 16 pcs
1Gb
G-die
256M x 8 * 8 pcs
2Gb
C-die
256M x 8 * 8 pcs
2Gb
D-die
M471B5773EB0
CH9/K0
256M x 8 * 8 pcs
2Gb
E-die
M471B5273CH0
CF8/H9/K0
256M x 8 * 16 pcs
2Gb
C-die
M471B5273DH0
CF8/H9/K0/MA
256M x 8 * 16 pcs
2Gb
D-die
M471B5273EB0
CH9/K0
256M x 8 * 16 pcs
2Gb
E-die
M471B1G73AH0
CF8/H9
512M x 8 * 16 pcs
4Gb
A-die
M471B1G73BH0 CF8/H9/K0/MA M471B1G73CH0
CH9/K0/MA
F(2Rx8)
F(2Rx8)
512M x 8 * 16 pcs
4Gb
B-die
512M x 8 * 16 pcs
4Gb
C-die
-6-
Internal Banks
Rank
PKG
Height
Avail.
8
1
78 ball FBGA
30mm
Now
8
2
78 ball FBGA
30mm
8
1
78 ball FBGA
30mm
Now Now Now Now Feb’12 Now
8
2
78 ball FBGA
30mm
Now Feb’12
8
2
78 ball FBGA
EOL Feb’12 30mm
Now Jun’12
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.5 204Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 64
1GB
M471B2873GB0
YF8/H9/K0
B(1Rx8)
128M x 8 * 8 pcs
F(2Rx8)
256Mx 64
256Mx 72
512Mx 64
512Mx 72
1Gx 64
1Gx 72
2GB
2GB
4GB
4GB
8GB
8GB
M471B5673GB0
YF8/H9/K0
M471B5773CHS
YF8/H9
M471B5773DH0
YF8/H9/K0
M471B5773EB0
YK0
M474B5773DH0
YF8/H9
M471B5273CH0
YF8/H9
M471B5273DH0
YF8/H9/K0
M471B5273EB0
YK0
M471B5173CH0
YH9/K0
M474B5273DH0
YF8/H9
M474B5173BH0
YF8/H9/K0
M474B5173CH0
YH9/K0
M471B1G73AH0
YF8/H9
M471B1G73BH0
YF8/H9/K0
M471B1G73CH0
YH9/K0
M474B1G73BH0
YF8/H9/K0
M471B1G73CH0
YH9/K0
B(1Rx8)
Comp. Version
78 ball FBGA
30mm
Now
128M x 8 * 16 pcs
1Gb
G-die
8
2
256M x 8 * 8 pcs
2Gb
C-die
256M x 8 * 8 pcs
2Gb
D-die
8
1
256M x 8 * 8 pcs
2Gb
E-die
256M x 8 * 16 pcs
2Gb
C-die
2Gb
D-die
256M x 8 * 16 pcs
2Gb
E-die
512M x 8 * 8 pcs
4Gb
C-die
D(2Rx8)
Avail.
1
256M x 8 * 16 pcs
F(2Rx8)
Height
8
F(2Rx8)
C(1Rx8)
PKG
G-die
256M x 8 * 9 pcs
D(2Rx8)
Rank
1Gb
C(1Rx8)
B(1Rx8)
Internal Banks
2Gb
D-die
256M x 8 * 18 pcs
2Gb
D-die
256M x 8 * 18 pcs
2Gb
B-die
512M x 8 * 9 pcs
4Gb
C-die
512M x 8 * 16 pcs
4Gb
A-die
512M x 8 * 16 pcs
4Gb
B-die
512M x 8 * 16 pcs
4Gb
C-die
512M x 8 * 18 pcs
4Gb
B-die
512M x 8 * 18 pcs
4Gb
C-die
* NOTE : 1.35V product is 1.5V operatable.
-7-
Now 78 ball FBGA
30mm
Now Now Nov’11
8
1
8
2
8
1
78 ball FBGA
30mm
Now Now
78 ball FBGA
Nov’11 Jun’12
8
2
78 ball FBGA
8
1
78 ball FBGA
2
78 ball FBGA
8
30mm
Now
30mm 30mm
Now Now Jun’12 EOL Feb’12
30mm
Now Jun’12
8
2
78 ball FBGA
30mm
Now Jun’12
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.6 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Comp. Version
Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 72
1GB
M393B2873GB0
CF8/H9/K0/MA
A(1Rx8)
128M x 8 * 9 pcs
1Gb
256Mx 72
512Mx 72
1Gx 72
2Gx 72
4Gx 72
2GB
4GB
8GB
16GB
Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
M393B5673GB0
CF8/H9/K0/MA
B(2Rx8)
128M x 8 * 18 pcs
1Gb
G-die
8
2
M393B5670GB0
CF8/H9/K0/MA
C(1Rx4)
256M x 4 * 18 pcs
1Gb
G-die
8
1
M393B5773CH0
CF8/H9/K0
256M x 8 * 9 pcs
2Gb
C-die
M393B5773DH0
CF8/H9/K0/MA
256M x 8 * 9 pcs
2Gb
D-die
A(1Rx8)
8
CF8/H9
H(4Rx8)
128M x 8 * 36 pcs
1Gb
G-die
8
4
M393B5170GB0
CF8/H9/K0/MA
E(2Rx4)
256M x 4 * 36 pcs
1Gb
G-die
8
2
M393B5273CH0
CF8/H9/K0
256M x 8 * 18 pcs
2Gb
C-die
M393B5273DH0
CF8/H9/K0/MA
256M x 8 * 18 pcs
2Gb
D-die
512M x 4 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
D-die
512M x 4 * 18 pcs
2Gb
E-die
256M x 8 * 36 pcs
2Gb
C-die
256M x 8 * 36 pcs
2Gb
D-die
512M x 4 * 36 pcs
2Gb
C-die
M393B5270CH0
CF8/H9/K0
M393B5270DH0
CF8/H9/K0/MA
M393B5270EB0
CH9
M393B1K73CH0
CF8/H9
C(1Rx4)
H(4Rx8)
78 ball FBGA
30mm
1
M393B5173GB0
B(2Rx8)
Now
8
2
8
1
Now Now Now Now Now Now
78 ball FBGA
30mm
Now Now Now Nov’11
8
Now
4
M393B1K73DH0
CF8/H9
M393B1K70CH0
CF8/H9/K0
M393B1K70DH0
CF8/H9/K0/MA
512M x 4 * 36 pcs
2Gb
D-die
Now
M393B1K70EB0
CH9
512M x 4 * 36 pcs
2Gb
E-die
Nov’11
M393B1G73AH0
CF8/H9/K0/MA
512M x 8 * 18 pcs
4Gb
A-die
M393B1G73BH0
CF8/H9/K0/MA
M393B1G73CH0
CMA
M393B1G70AH0
CF8/H9/K0/MA
M393B1G70BH0
CF8/H9/K0/MA
M393B1G70CH0
CMA
M393B2K70DM0
CF8/H9
M393B2G70AH0
CF8/H9
M393B2G70BH0
CF8/H9
M393B2G73AH0
CF8/H9
M393B2G73BH0
CF8/H9
M393B2G73CH0
CMA
M393B4G70AM0
CF8/H9
32GB
E(2Rx4)
B(2Rx8)
C(1Rx4)
AB(4Rx4) E(2Rx4)
H(4Rx8)
AB(4Rx4) M393B4G70BM0
CF8/H9
Now Now
8
2 78 ball FBGA
30mm
EOL Feb’12
512M x 8 * 18 pcs
4Gb
B-die
Now
512M x 8 * 18 pcs
4Gb
C-die
Jun’12
1G x 4 * 18 pcs
4Gb
A-die
EOL Feb’12
1G x 4 * 18 pcs
4Gb
B-die
512M x 8 * 18 pcs
4Gb
C-die
DDP x 4 * 36 pcs 1G
2Gb
D-die
1G x 4 * 36 pcs
4Gb
A-die
1G x 4 * 36 pcs
4Gb
B-die
512M x 8 * 36 pcs
4Gb
A-die
512M x 8 * 36 pcs
4Gb
B-die
512M x 8 * 36 pcs
4Gb
C-die
DDP x 4 * 36 pcs 2G
4Gb
A-die
DDP x 4 * 36 pcs 2G
4Gb
-8-
8
Now Jun’12
8
4
8
2
8
Now Now 78 ball FBGA
30mm
Now Now
4
Now Jun’12
8 B-die
1
4
78 ball FBGA
Now 30mm Now
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.7 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Internal Banks
Rank
PKG
Height
Avail.
8
1
78 ball FBGA
30mm
Now
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M393B2873GB0
YF8/H9/K0
A(1Rx8)
M393B5673GB0
YF8/H9/K0
B(2Rx8)
128M x 8 * 18 pcs
1Gb
G-die
8
2
M393B5670GB0
YF8/H9/K0
C(1Rx4)
256M x 4 * 18 pcs
1Gb
G-die
8
1
M393B5773CH0
YF8/H9
256M x 8 *
9 pcs
2Gb
C-die
M393B5773DH0
YF8/H9/K0
256M x 8 *
9 pcs
2Gb
D-die
256Mx 72
512Mx 72
1Gx 72
2Gx 72
2GB
4GB
8GB
16GB
128M x 8 *
9 pcs
1Gb
G-die
8
1
M393B5173GB0
YF8/H9
H(4Rx8)
128M x 8 * 36 pcs
1Gb
G-die
8
4
M393B5170GB0
YF8/H9/K0
E(2Rx4)
256M x 4 * 36 pcs
1Gb
G-die
8
2
M393B5273CH0
YF8/H9
256M x 8 * 18 pcs
2Gb
C-die
M393B5273DH0
YF8/H9/K0
256M x 8 * 18 pcs
2Gb
D-die
B(2Rx8)
M393B5273EB0
YH9/K0
256M x 8 * 18 pcs
2Gb
E-die
M393B5270CH0
YF8/H9
512M x 4 * 18 pcs
2Gb
C-die
M393B5270DH0
YF8/H9/K0
512M x 4 * 18 pcs
2Gb
D-die
M393B5270EB0
YH9/K0
512M x 4 * 18 pcs
2Gb
E-die
512M x 8 *
M393B5173CH0
YH9/K0
M393B1K73CH0
YF8/H9
M393B1K73DH0
YF8/H9
M393B1K73EB0
YH9
M393B1K70CH0
YF8/H9
M393B1K70DH0
YF8/H9/K0
M393B1K70EB0
YH9/K0
M393B1G73AH0
YF8/H9
M393B1G73BH0
YF8/H9/K0
M393B1G73CH0
C(1Rx4)
A(1Rx8)
H(4Rx8)
E(2Rx4)
9 pcs
4Gb
C-die
256M x 8 * 36 pcs
2Gb
C-die
256M x 8 * 36 pcs
2Gb
D-die
256M x 8 * 36 pcs
2Gb
E-die
512M x 4 * 36 pcs
2Gb
C-die
512M x 4 * 36 pcs
2Gb
D-die
512M x 4 * 36 pcs
2Gb
E-die
Now 78 ball FBGA
30mm
Now Now Now Now Now Now
8
2
Now 78 ball FBGA
30mm
Nov’11 Now
8
1
Now Nov’11
8
1
8
4
Jun’12 Now Now Nov’11 Now
8
2
Now Nov’11 78 ball FBGA
30mm
EOL Feb’12
512M x 8 * 18 pcs
4Gb
A-die
512M x 8 * 18 pcs
4Gb
B-die
YH9/K0
512M x 8 * 18 pcs
4Gb
C-die
Jun’12
M393B1G70AH0
YF8/H9
1G x 4 * 18 pcs
4Gb
A-die
EOL Feb’12
M393B1G70BH0
YF8/H9/K0
1G x 4 * 18 pcs
4Gb
B-die
M393B1G70CH0
YH9/K0
1G x 4 * 18 pcs
4Gb
C-die
M393B2K70DM0
YF8/H9
DDP x 4 * 36 pcs 1G
2Gb
D-die
M393B2G70AH0
YF8/H9
1G x 4 * 36 pcs
4Gb
A-die
M393B2G70BH0
YF8/H9/K0
1G x 4 * 36 pcs
4Gb
B-die
M393B2G70CH0
YH9/K0
1G x 4 * 36 pcs
4Gb
C-die
M393B2G73AH0
YF8/H9
512M x 8 * 36 pcs
4Gb
A-die
M393B2G73BH0
YF8/H9
512M x 8 * 36 pcs
4Gb
B-die
M393B2G73CH0
YH9/K0
512M x 8 * 36 pcs
4Gb
C-die
YF8/H9
DDP x 4 * 36 pcs 2G
4Gb
A-die
DDP x 4 * 36 pcs 2G
4Gb
M393B4G70AM0 4Gx 72
A(1Rx8)
Composition
Comp. Version
Org.
B(2Rx8)
C(1Rx4)
AB(4Rx4)
E(2Rx4)
H(4Rx8)
AB(4Rx4)
32GB M393B4G70BM0
YF8/H9
AB(4Rx4)
* NOTE : 1.35V product is 1.5V operatable.
-9-
8
8
Now
1
Now Jun’12
8
4
Now EOL Feb’12
8
2 78 ball FBGA
Now 30mm
Jun’12 EOL Feb’12
8
4
Now Jun’12
8 B-die
2
4
78 ball FBGA
Now 30mm Now
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.8 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org.
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M392B2873GB0
CF8/H9/K0/MA
K(1Rx8)
256Mx 72
512Mx 72
2GB
4GB
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
18.75mm
Now
8
2
8
1
CF8/H9/K0/MA
L(2Rx8)
128M x 8 * 18 pcs
1Gb
G-die
M(1Rx4)
256M x 4 * 18 pcs
1Gb
G-die
M392B5773CH0
CF8/H9/K0
256M x 8 *
9 pcs
2Gb
C-die
M392B5773DH0
CF8/H9/K0/MA
256M x 8 *
9 pcs
2Gb
D-die
256M x 8 * 18 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
D-die
512M x 4 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
D-die
DDP x 8 * 18 pcs 512M
2Gb
C-die
M392B5273CH0
CF8/H9/K0
M392B5273DH0
CF8/H9/K0/MA
M392B5270CH0
CF8/H9/K0
M392B5270DH0
CF8/H9/K0/MA
M392B1K73CM0
CF8/H9
K(1Rx8)
L(2Rx8)
M(1Rx4)
Now 78 ball FBGA
18.75mm
Now Now Now
8
Now
2 78 ball FBGA
8
1
8
4
18.75mm
Now Now Now Now
M392B1K73DM0
CF8/H9
DDP x 8 * 18 pcs 512M
2Gb
D-die
Now
M392B1K70CM0
CF8/H9/K0
DDP x 4 * 18 pcs 1G
2Gb
C-die
Now
DDP x 4 * 18 pcs 1G
2Gb
D-die
M392B1K70DM0
CF8/H9/K0/MA
M392B1G73AH0
CF8/H9/K0
M392B1G73BH0
CF8/H9/K0/MA
M392B1G73CH0
8
2
78 ball FBGA
18.75mm
Now
512M x8 * 18 pcs
4Gb
A-die
512M x8 * 18 pcs
4Gb
B-die
Now
CH9/K0/MA
512M x8 * 18 pcs
4Gb
C-die
Jun’12
M392B1G70AH0
CF8/H9/K0
1G x4 * 18 pcs
4Gb
A-die
EOL Feb’12
L(2Rx8)
M392B1G70BH0
CF8/H9/K0/MA
1G x4 * 18 pcs
4Gb
B-die
M392B1G70CH0
CH9/K0/MA
512M x8 * 18 pcs
4Gb
C-die
M392B2G70AM0
CF8/H9
DDP x4 * 18 pcs 2G
4Gb
A-die
DDP x4 * 18 pcs 2G
4Gb
DDP x8 * 18 pcs 1G
4Gb
M392B2G70BM0
M(1Rx4)
CF8/H9/K0/MA
16GB M392B2G73AM0
CF8/H9 V(4Rx8)
4Gx 72
1Gb
Rank
CF8/H9/K0/MA
N(2Rx4) 2Gx 72
9 pcs
Internal Banks
M392B5670GB0
N(2Rx4) 8GB
128M x 8 *
Comp. Version
M392B5673GB0
V(4Rx8)
1Gx 72
Composition
B-die
M392B4G70AE0
CF8/H9
QDP x4 * 18 pcs 4G
4Gb
A-die
QDP * x4 18 pcs 4G
4Gb
CF8/H9
- 10 -
78 ball FBGA 8
4Gb
M392B4G70BE0
Now
A-die
DDP x8 * 18 pcs 1G
Now 18.75mm Now
4 Now
8 B-die
Now
2
B-die
CF8/H9
N(2Rx4)
1
Jun’12
8
M392B2G73BM0
32GB
8
EOL Feb’12
2
78 ball FBGA
Now 18.75mm Now
NOTE
Jan. 2012
Product Guide
DDR3 SDRAM Memory
4.9 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Comp. Version
Rank
8
1
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M392B2873GB0
YF8/H9/K0
K(1Rx8)
M392B5673GB0
YF8/H9/K0
L(2Rx8)
128M x 8 * 18 pcs
1Gb
G-die
8
2
M392B5670GB0
YF8/H9/K0
M(1Rx4)
256M x 4 * 18 pcs
1Gb
G-die
8
1
M392B5773CH0
YF8/H9
512M x 4 * 9 pcs
2Gb
C-die
M392B5773DH0
YF8/H9/K0
512M x 4 * 9 pcs
2Gb
D-die
256M x 8 * 18 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
D-die
512M x 4 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
D-die
512M x 8 * 9 pcs
4Gb
C-die
DDP x 8 * 18 pcs 512M
2Gb
C-die
256Mx 72
512Mx 72
2GB
4GB
M392B5273CH0
YF8/H9
M392B5273DH0
YF8/H9/K0
M392B5270CH0
YF8/H9
M392B5270DH0
YF8/H9/K0
M392B5173CH0
YH9/K0
M392B1K73CM0
K(1Rx8)
L(2Rx8)
M(1Rx4) K(1Rx8)
YF8/H9 V(4Rx8)
8GB
G-die
2Gb
D-die
M392B1K70CM0
YF8/H9
DDP x 4 * 18 pcs 1G
2Gb
C-die
DDP x 4 * 18 pcs 1G
2Gb
M392B1K70DM0
YF8/H9/K0
M392B1G73AH0
YF8/H9/K0
M392B1G73BH0
YF8/H9/K0
M392B1G73CH0
YH9/K0
M392B1G70AH0
YF8/H9/K0
M392B1G70BH0
YF8/H9/K0
M392B1G70CH0 M392B2G70AM0
L(2Rx8)
512M x8 * 18 pcs
4Gb
A-die
512M x 8 * 18 pcs
4Gb
B-die
512M x 8 * 18 pcs
4Gb
C-die
4Gb
A-die
4Gb
B-die
YH9/K0
1G x 4 * 18 pcs
4Gb
C-die
YF8/H9
DDP x4 * 18 pcs 2G
4Gb
A-die
YF8/H9/K0
DDP x4 * 18 pcs 2G
4Gb
B-die
M392B2G73AM0
YF8/H9
DDP x8 * 18 pcs 1G
4Gb
A-die
YF8/H9
DDP x8 * 18 pcs 1G
4Gb
B-die
M392B4G70AE0
YF8/H9
QDP x4 * 18 pcs 4G
4Gb
A-die
QDP x4 * 18 pcs 4G
4Gb
M392B4G70BE0
YF8/H9
Height
8
Avail.
NOTE
Now Now
78 ball 18.75mm FBGA
Now Now Now Now Now
78 ball 18.75mm FBGA 1
Now Now Jun’12 Now
4 Now Now 2 78 ball 18.75mm FBGA
8
2
Now EOL Feb’12 Now Jun’12 EOL Feb’12
8
1
Now Jun’12 EOL Feb’12
2 78 ball 18.75mm FBGA
8
M392B2G73BM0
N(2Rx4)
2
8
M392B2G70BM0
32GB
8
PKG
78 ball 18.75mm FBGA
D-die
1G x4 * 18 pcs
16GB
1
8
1G x 4 * 18 pcs
M(1Rx4)
8
8
DDP x 8 * 18 pcs 512M
V(4Rx8)
4Gx 72
1Gb
YF8/H9
N(2Rx4) 2Gx 72
128M x 8 * 9 pcs
M392B1K73DM0
N(2Rx4) 1Gx 72
Composition
Internal Banks
Org.
Now EOL Feb’12
4 Now
8
78 ball 18.75mm FBGA
2
B-die
Now Now
* NOTE : 1.35V product is 1.5V operatable.
4.10 240Pin DDR3 LRDIMM (1.35V Product) 240Pin DDR3 LDIMM Org.
Density
Part Number
Speed
2G x 72
16GB
M386B2G70DM0
YH9/K0
Raw Card
C(4Rx4) 4G x 72
32GB
M386B4G70BM0
YH9
Composition
Comp. Version
DDP x 4 * 36 pcs 1G
2Gb
DDP x 4 * 36 pcs 2G
4Gb
* NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 12page.
- 11 -
D-die B-die
Internal Banks
Rank
PKG
Height
4
78 ball FBGA
30mm
8 8
Avail.
NOTE
Now 1) Now
Jan. 2012
Product Guide
DDR3 SDRAM Memory
5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example
4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2
Made in Korea
M393B5270DH0-CK0
1102
5.3 RCD Information - Example JEDEC Description
PKG
RCD Vendor
RCD Version(Rev.)
1Gb F-die 2Gb C-die 4Gb A-die
IDT
HLB(B0)
D2
Inphi
GS04(1.5V)/LV-GS02(1.35V)
P1
IDT
A1(evergreen)
D3
Inphi
UV-GS02
P2
1Gb G-die 2Gb D-die 4Gb B-die
(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)
* NOTE 1) PC3L is used for 1.35V 2)RCD information is subject to change.
- 12 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
6. LRDIMM Memory Buffer Information 6.1 Label Example
16GB 4Rx4 PC3L - 10600L - 09 - 11 - C0
Made in Korea
M386B2K70DM0-YH90 1102
6.2 Memory Buffer Information - Example Voltage
Vendor
Revision
Module P/N
JEDEC Description On Label
Inphi
iMB02-GS02A
M386B2K70DM0-YH901
16GB 4Rx4 PC3L-10600L-09-11-C0
IDT
MB3 B0
M386B2K70DM0-YH911
16GB 4Rx4 PC3L-10600L-09-11-C0
1.35V
* NOTE 1) The 16th digit refers memory buffer vendor and revision. 0: Inphi iMB02-GS02A 1: IDT MB3 B0 2) Memory buffer information is subject to change.
- 13 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
7. Package Dimension
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
3.20
#A1
11.00 ± 0.10
0.80
0.80 x 12 = 9.60
4.80
A B C D E F G H J K L M N
0.80
(Datum B)
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
0.50 ± 0.05
0.80 1.60
11.00 ± 0.10
(Datum A)
0.10MAX
78Ball FBGA for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2 M A B
BOTTOM VIEW
TOP VIEW
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
3.20
#A1
0.80 x 12 = 9.60
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.00 ± 0.10
1.60
11.00 ± 0.10
0.80
(Datum A)
0.10MAX
78Ball FBGA for 2Gb E-die (x4/x8)
78 - ∅0.48 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.37 ± 0.05
(0.30) (0.60)
MOLDING AREA
1.10 ± 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 14 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
8.00 ± 0.10 0.80 x 8 = 6.40 (Datum A)
0.80
1.60
0.10MAX
78Ball DDP for 2Gb C-die (x4/x8)
A #A1 INDEX MARK
3.20
#A1 9 8 7 6 5 4 3 2 1
11.00 ± 0.10
11.00 ± 0.10
0.80 x 12 = 9.60
0.80
0.80
4.80
A B C (Datum B) D E F G H J K L M N
8.00 ± 0.10
B
0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
1.40 ± 0.10
0.2 M A B
TOP VIEW
BOTTOM VIEW
0.80
(Datum A)
1.60
A #A1 INDEX MARK
3.20
#A1
0.80 x 12 = 9.60
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
11.00 ± 0.10
0.80 x 8 = 6.40
11.00 ± 0.10
7.50 ± 0.10
0.10MAX
78Ball DDP for 2Gb D-die (x4/x8)
0.35 ± 0.05 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
1.10 ± 0.10
0.2 M A B
TOP VIEW
BOTTOM VIEW
- 15 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
78Ball DDP for 4Gb A-die (x4/x8) A
0.10MAX
10.50 ± 0.10 0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60 B
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
#A1
10.50 ± 0.10
12.00 ± 0.10
0.80
12.00 ± 0.10
(Datum A)
78 - ∅0.45 ± 0.05 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.35 ± 0.05 1.10 ± 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
78Ball DDP for 4Gb B-die (x4/x8) A
0.10MAX
11.00 ± 0.10 0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60 B
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
#A1
11.00 ± 0.10
11.00 ± 0.10
0.80
11.00 ± 0.10
(Datum A)
78 - ∅0.45 ± 0.05 Solder ball (Post Reflow ∅0.50 ± 0.05)
0.35 ± 0.05 1.10 ± 0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 16 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 4Gb A-die (x4/x8) 10.00 ± 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20 0.80
#A1 INDEX MARK
1.60 B
78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05)
#A1
10.00 ± 0.10
12.50 ± 0.10
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1
12.50 ± 0.10
(Datum A)
(0.95) MOLDING AREA
0.35 ± 0.05 1.10 ± 0.10
(1.90)
0.2 M A B
BOTTOM VIEW
TOP VIEW
78Ball FBGA for 4Gb B-die (x4/x8) 10.00 ± 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60
4.80 0.80
78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B
10.00 ± 0.10
0.80
(Datum B)
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
#A1
B
11.00 ± 0.10
0.80
11.00 ± 0.10
(Datum A)
(0.95)
0.35 ± 0.05 MOLDING AREA 1.10 ± 0.10
(1.90)
BOTTOM VIEW
TOP VIEW
- 17 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 4Gb C-die (x4/x8) 8.50 ± 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60
4.80 0.80
8.50 ± 0.10
0.80
(Datum B)
0.80 x 12 = 9.60
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
#A1
B
11.00 ± 0.10
0.80
11.00 ± 0.10
(Datum A)
78 - ∅0.50 Solder ball (Post Reflow ∅0.50 ± 0.05)
(0.95)
0.20 M A B
0.35 ± 0.05
MOLDING AREA
1.10 ± 0.10
TOP VIEW
(1.90)
BOTTOM VIEW
TOP VIEW
3.20
#A1 INDEX MARK #A1
0.35 ± 0.05 (0.30)
78 - ∅0.48 Solder ball (Post Reflow ∅0.05 ± 0.05) 0.2 M A B
0.80 x 12 = 9.60
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
7.50 ± 0.10
B
9 8 7 6 5 4 3 2 1
0.50 ± 0.05
0.80 1.60
11.00 ± 0.10
(Datum A)
A
11.00 ± 0.10
7.50 ± 0.10 0.80 x 8 = 6.40
0.10MAX
78Ball FBGA Flip chip for 1Gb G-die (x4/x8)
MOLDING AREA
1.10 ± 0.10
(0.60)
Top
Bottom
- 18 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
8. Module Dimension x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
128.95
ECC
SPD
17.30
9.50
N/A
(for x64)
2.30
(for x72)
30.00 ± 0.15
(4X)3.00 ± 0.1
133.35 ± 0.15
(2) 2.50 54.675 A
B
47.00
Max 4.0
71.00
N/A
(for x64)
ECC
(for x72)
2.50 ± 0.20
1.270 ± 0.10
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10
1.00
2.50
Detail A
Detail B
- 19 -
2x 2.10 ± 0.15
Jan. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM ECC VLP UDIMM
Units : Millimeters
133.35 ± 0.15 Max 4.0
18.75 ± 0.15
128.95
SPD/TS
54.675 1.0 max
A
D
B
47.00
1.27 ± 0.10
71.00 C
2x 2.10 ± 0.15
2.50 ± 0.20
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10 2.50
Detail A
1.00
Detail B
- 20 -
(2)xR0.8
Detail C & D
Jan. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x64 204pin DDR3 SDRAM Unbuffered SODIMM 67.60 ± 0.13 63.60
6
20.00
SPD
30.00 ± 0.13
Max 3.8
1.00 ± 0.10 24.80
A 21.00
B 39.00
2X 1.80 0.10 M C A B (OPTIONAL HOLES)
2X 4.00 ± 0.10 0.10 M C A B
0.60 0.45 ± 0.03
1.65
4.00 ± 0.10
2.55 0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 21 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x72 204 pin DDR3 SDRAM ECC Unbuffered SODIMM 67.60 ± 0.13 63.60
6
20.00
30.00 ± 0.13
Max 3.8
1.00 ± 0.10 24.80
A
B 39.00
21.00 SPD
2X 1.80 0.10 M C A B (OPTIONAL HOLES)
2X 4.00 ± 0.10 0.10 M C A B
0.60 0.45 ± 0.03
1.65
4.00 ± 0.10
2.55 0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 22 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters C
128.95 32.40
18.93
9.74
Max 4.0
54.675
2.30
2.50 A
1.0 max
B
47.00
1.27 ± 0.10
2.50 ± 0.20
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.00
10.9
R
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Register
2.50
17.30
Register
30.00 ± 0.15
18.92
0. 50
10.9
9.50
9.76
(2X)3.00
133.35 ± 0.15
Address, Command and Control lines
- 23 -
0.4
Jan. 2012
Product Guide
DDR3 SDRAM Memory
Registered DIMM Heat Spreader Design 1. FRONT PART Outside
R0.2
4.65± 0.12
2
2
2 ± 0.1
2.6 ± 0.2
0.4
Inside Green Line : TIM Attatch Line
7.45
Reg. pedestal line
80.78 119.29 128.5
2. BACK PART Outside
Inside
0.15 1.3
Green Line : TIM Attatch Line
- 24 -
1.3
1 0. R
127 ± 0.12
25.6 ± 0.15
31.4
23.6 ± 0.15
11.9
29.77
1
25.6 ± 0.15
0.65 ± 0.2
130.45 ± 0.15
9.26
1+0/ -0.3
133.15 ± 0.2
Jan. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap
29.77
6.3± 0.12
5 1. R
7.3 ± 0.1
44.4
0.1 ~ 0.3
0.5
4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : 7.55mm (With Clip thickness)
3.77
1.27
133.15
7.3 ± 0.1
19 ± 0.12
19 ± 0.12
39.3 ± 0.2
D text mark ’D’ punch press_stamp
- 25 -
Clip open size 2.6~3.8
Jan. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP Registered DIMM
Units : Millimeters 133.35 ± 0.15 128.95 C 20.92
32.40
20.93
Max 4.0 9.74
Register
18.75 ± 0.15
9.76
54.675 A
B
12.60
47.00
1.0 max
71.00
1.27 ± 0.10 SPD/TS
2.50 ± 0.20
18.10
0.80 ± 0.05 9.9
3.80
0.6
5.00
0.2 ± 0.15
Detail B
Detail C
VTT
Register
Detail A
R
1.00
2.50
VTT
0. 50
1.50±0.10
VTT
VTT
SPD/TS
Address, Command and Control lines
- 26 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design (DDP) 1. FRONT PART Outside 130.45 67 20.82
35.98
20.82
8.69
14.3
0.4
8.69
Driver IC(DP:0.18mm)
Inside
Driver IC(DP:0.18mm)
2. BACK PART Outside
Driver IC(DP:0.18mm)
Inside
Driver IC(DP:0.18mm)
- 27 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
35.82
9.16 ± 0.12
7.2 ± 0.1
9.16
9.16 ± 0.12
7.2 ± 0.1
Clip open size 3.0~4.3
SIDE-L
0.1
FRONT
SIDE-R
4. ASS’Y VIEW
7.55
Reference thickness total (Maximum) : 7.55 (With Clip thickness)
TIM Thickness 0.25
- 28 -
Jan. 2012
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design (QDP) 1. FRONT PART Outside
127 ± 0.12 51.97 36.56 21.15
9.07
9.07
9.07
9.07
Caution "Hot surfoce"
11.6
51.95
Inside
2. BACK PART
Outside
Inside
- 29 -
13.6±0.15
9
Jan. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART 36.82 ± 0.12
Clip open size 3.85 ± 0.65
SIDE-L
7.40 ± 0.1
9.16
9.16 ± 0.12
9.16
7.40 ± 0.1
QU 0.40 ± 0.05
FRONT
SIDE-R
4. ASS’Y VIEW
8
Reference thickness total (Maximum) : 8 (With Clip thickness)
TIM Thickness 0.25
- 30 -