Story Transcript
Dec. 2012
DDR3 SDRAM Memory
Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. གྷ 2012 Samsung Electronics Co., Ltd.GG All rights reserved.
-1-
Dec. 2012
Product Guide
DDR3 SDRAM Memory
1. DDR3 SDRAM MEMORY ORDERING INFORMATION 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
K 4 B X X X X X X X - X X X X Speed
SAMSUNG Memory DRAM
Temp & Power
DRAM Type
Package Type
Density
Revision Interface (VDD, VDDQ)
Bit Organization
# of Internal Banks
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type B : DDR3 SDRAM
10. Revision M : 1st Gen. A : 2nd Gen. B : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. H : 9th Gen.
4~5. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 8G : 8Gb AG : 16Gb
11. "-" 12. Package Type H M B E O
6~7. Bit Organization 04 : 08 : 16 : 33 :
x4 x8 x16 x32
9. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V)
FBGA (Halogen-free & Lead-free) FBGA (Halogen-free & Lead-free, DDP) FBGA (Halogen-free & Lead-free, Flip Chip) FBGA(Lead-free & Halogen-free, QDP) FBGA(Lead-free & Halogen-free, QDP for 64GB LRDIMM)
13. Temp & Power C : Commercial Temp.( 0qC ~ 85qC) & Normal Power(1.5V) Y : Commercial Temp.( 0qC ~ 85qC) & Low VDD(1.35V) K : Commercial Temp.( 0qC ~ 85qC) & Low VDD(1.35V) & RS( Reduced Standby )
8. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks
: : : : :
14~15. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 MA : DDR3-1866
-2-
(400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) (933MHz @ CL=13, tRCD=13, tRP=13)
Dec. 2012
Product Guide
DDR3 SDRAM Memory
2. DDR3 SDRAM Component Product Guide Density
1Gb G-die
2Gb C-die
2Gb D-die
2Gb E-die
4Gb B-die
4Gb C-die
Banks
8Banks
8Banks
8Banks
8Banks
8Banks
8Banks
Part Number
8G B-die
16G B-die
8Banks
8Banks
8Banks
Org.
K4B1G0446G
BCF8/H9/K0/MA
256M x 4
K4B1G0846G
BCF8/H9/K0/MA
128M x 8
K4B1G0446G
BYF8/H9/K0
256M x 4
K4B1G0846G
BYF8/H9/K0
128M x 8
K4B2G0446C
HCF8/H9/K0
512M x 4
K4B2G0846C
HCF8/H9/K0
256M x 8
K4B2G0446C
HYF8/H9
512M x 4
K4B2G0846C
HYF8/H9
256M x 8
K4B2G0446D
HCF8/H9/K0/MA
512M x 4
K4B2G0846D
HCF8/H9/K0/MA
256M x 8
K4B2G0446D
HYF8/H9/K0
512M x 4
K4B2G0846D
HYF8/H9/K0
256M x 8
K4B2G0446E
BCH9/K0/MA
512M x 4
K4B2G0846E
BCH9/K0/MA
256M x 8
K4B2G0446E
BYH9/K0
512M x 4
K4B2G0846E
BYH9/K0
256M x 8
K4B4G0446B
HCF8/H9/K0/MA
1G x 4
K4B4G0846B
HCF8/H9/K0/MA
512M x 8
K4B4G1646B
HCH9/K0
256M x 16
K4B4G0446B
HYF8/H9/K0
K4B4G0846B
HYF8/H9/K0
512M x 8
K4B4G1646B
HYH9/K0
256M x 16
K4B4G0446C
BCH9/K0/MA
1G x 4
K4B4G0846C
BCH9/K0/MA
512M x 8
K4B4G0446C
BYH9/K0
K4B4G0846C
4Gb D-die
Package & Power, Temp. & Speed
VDD Voltage1
Now
78 ball FBGA
Now
1.5V
1.35V
1.5V 78 ball FBGA
Now
1.35V
1.5V 78 ball FBGA
Now
1.35V
1.5V 78 ball FBGA
Now
78 ball FBGA
1Q’13
96 ball FBGA
Now
136 ball FBGA
Now
78 ball FBGA
Now
78 ball FBGA
Now
1.35V
BCH9/K0/MA
1G x 4
BCH9/K0/MA
512M x 8
K4B4G0446D
BYH9/K0
1G x 4
K4B4G0846D
BYH9/K0
512M x 8
K4B8G1646B
MCK0
DDP 512M x 16
1.5V
K4B8G1646B
MYH9/K0
DDP 512M x 16
1.35V
K4B8G3346B
MCH9/K0
DDP 256M x 32
1.5V
K4B8G3346B
MYH9/K0
DDP 256M x 32
1.35V
K4BAG0446B
ECH9/K0
QDP 4G x 4
1.5V
K4BAG0446B
EYH9/K0
QDP 4G x 4
1.35V
K4BAG0446B
OCK0
QDP 4G x4
1.5V
K4BAG0446B
OYF8/H9/K0
QDP 4G x4
1.35V
-3-
78 ball FBGA 1.35V
K4B4G0846D
1. 1.35V product is 1.5V operatable.
Now
1.5V
K4B4G0446D
*GNOTE
78 ball FBGA 1.35V
1G x 4 512M x 8
Avail.
1.5V
1G x 4
BYH9/K0
PKG
1.5V
1.35V
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
3. DDR3 SDRAM Module Ordering Information 1
2
3
4
5
6
7
8
9
10
11
12
13 14
15
16
171
M X X X B X X X X X X X - X X X X Memory Module DIMM Type Data bits
Memory Buffer Speed
DRAM Component Type
Temp & Power
Depth
PCB Revision Package
# of Banks in Comp. & Interface
Component Revision
Bit Organization 1. Memory Module : M 2. DIMM Type 3 : DIMM 4 : SODIMM 3~4. Data Bits 71 : 74 : 78 : 86 : 90 : 91 : 92 : 93 :
x64 x72 x64 x72 x72 x72 x72 x72
204pin Unbuffered SODIMM 204pin ECC Unbuffered SODIMM 240pin Unbuffered DIMM 240pin LR DIMM 240pin VLP Unbuffered DIMM 240pin ECC Unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM
5. DRAM Component Type B : DDR3 SDRAM
33 : 32M (for 128Mb/512Mb) 65 : 64M (for 128Mb/512Mb) 29 : 128M (for 128Mb/512Mb) 57 : 256M (for 512Mb/2Gb) 52 : 512M (for 512Mb/2Gb) 1K : 1G (for 2Gb) 2K : 2G (for 2Gb)
8. # of Banks in comp. & Interface 7 :
12. PCB Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev.
1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer
13. "_"
6~7. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G: 1G 2G: 2G 4G: 4G 8G: 8G
10. Component Revision M : 1st Gen. A : 2nd Gen. B : 3rd Gen. C : 4th Gen. D : 5th Gen. E : 6th Gen. F : 7th Gen. G : 8th Gen. 11. Package Z : FBGA(Lead-free) H : FBGA(Lead-free & Halogen-free) J : FBGA(Lead-free, DDP) M : FBGA(Lead-free & Halogen-free, DDP) B : FBGA (Halogen-free & Lead-free, Flip Chip) E : FBGA(Lead-free & Halogen-free, QDP) O : FBGA(Lead-free & Halogen-free, QDP for 64GB LRDIMM)
14. Temp & Power C : Commercial Temp.( 0qC ~ 85qC) & Normal Power(1.5V) Y : Commercial Temp.( 0qC ~ 85qC) & Low VDD(1.35V) 15~16. Speed2 F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 MA: DDR3-1866
(400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) (933MHz @ CL=13, tRCD=13, tRP=13)
17. Memory Buffer
8Banks & SSTL-1.5V
0 1 2 3 4
9. Bit Organization 0 : x4 3 : x8 4 : x16
: : : : :
Inphi iMB02-GS02A IDT A2 (Greendale) Montage MB C0 Inphi iMB02-GS02B Montage MB CI
NOTE: 1. Only used for LRDIMM 2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) PC3-14900(DDR3-1866)
-4-
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org.
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M391B2873GB0
CF8/H9/K0/MA
D(1Rx8)
M378B5773CH0
CF8/H9/K0
256Mx 64
256Mx 72
512Mx 64
512Mx 72
1Gx 64
1Gx 72
2GB
2GB
4GB
4GB
8GB
8GB
M378B5773DH0
CF8/H9/K0/MA
M378B5773EB0
CH9/K0/MA
M391B5673GB0
CF8/H9/K0/MA
M391B5773CH0
CF8/H9/K0
A(1Rx8)
E(2Rx8)
D(1Rx8)
Composition
Comp. Version
128M x 8 * 9 pcs
1Gb
G-die
256M x 8 * 8 pcs
2Gb
C-die
256M x 8 * 8 pcs
2Gb
D-die
256M x 8 * 8 pcs
2Gb
E-die
128M x 8 * 18 pcs
1Gb
G-die
256M x 8 * 9 pcs
2Gb
C-die
Internal Banks
Rank
PKG
Height
Avail.
8
1
78 ball FBGA
30mm
Now
8
1
78 ball FBGA
8
2
Now 30mm
Now Now
Now 30mm
CF8/H9/K0/MA
256M x 8 * 9 pcs
2Gb
D-die
CH9/K0/MA
256M x 8 * 9 pcs
2Gb
E-die
Now
M378B5273CH0
CF8/H9/K0
256M x 8 * 16 pcs
2Gb
C-die
Now
M378B5273DH0
CF8/H9/K0
256M x 8 * 16 pcs
2Gb
D-die
M378B5273EB0
CH9/K0/MA
256M x 8 * 16 pcs
2Gb
E-die
CK0
512M x 8 * 8 pcs
4Gb
C-die
M378B5173DB0
CK0/MA
512M x 8 * 8 pcs
4Gb
D-die
M391B5273CH0
CF8/H9/K0
256M x 8 * 18 pcs
2Gb
C-die
D(1Rx8)
8
1
78 ball FBGA
M391B5773EB0
M378B5173CB0
8
Now
M391B5773DH0
B(2Rx8)
2
Now 78 ball FBGA
8
Now
30mm
Now Now
1
1Q’13 Now 78 ball FBGA
30mm
M391B5273DH0
CF8/H9/K0/MA
256M x 8 * 18 pcs
2Gb
D-die
M391B5273EB0
CH9/K0/MA
256M x 8 * 18 pcs
2Gb
E-die
Now
M378B1G73BH0
CF8/H9/K0
512M x 8 * 16 pcs
4Gb
B-die
Now
M378B1G73CB0
CK0
512M x 8 * 16 pcs
4Gb
C-die
M378B5173DB0
CK0/MA
1G x 8 * 8 pcs
4Gb
D-die
M391B1G73BH0 CF8/H9/K0/MA
E(2Rx8)
B(2Rx8)
E(2Rx8)
512M x 8 * 18 pcs
4Gb
B-die
NOTE
8
8
2
2 78 ball FBGA
8
2
78 ball FBGA
30mm
Now
Now 1Q’13
30mm
Now
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
1Gb
G-die
8
2
2Gb
C-die
78 ball FBGA
30mm
Now
256M x 8 * 9 pcs
2Gb
D-die
256M x 8 * 18 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
D-die
Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 72
1GB
M391B2873GB0
YF8/H9/K0
D(1Rx8)
128M x 8 * 9 pcs
1Gb
M391B5673GB0
YF8/H9/K0
E(2Rx8)
128M x 8 * 18 pcs
256Mx 72
2GB
M391B5773CH0
YF8/H9
256M x 8 * 9 pcs
M391B5773DH0
YF8/H9/K0
M391B5273CH0
YF8/H9
M391B5273DH0
YF8/H9/K0
512Mx 72 1Gx 72
4GB 8GB
M391B1G73BH0
YF8/H9/K0
D(1Rx8)
E(2Rx8) E(2Rx8)
512M x 8 * 18 pcs
*GNOTE : 1.35V product is 1.5V operatable.
-5-
4Gb
B-die
Now
8
1
8
2
78 ball FBGA
30mm
2
78 ball FBGA
30mm
8
Now Now Now Now
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.3 240Pin DDR3 VLP Unbuffered DIMM (1.35V Product) 240Pin DDR3 VLP Unbuffered DIMM Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
D-die
8
1
78 ball FBGA
18.75mm
Now
2Gb
D-die
8
2
B-die
8
1
78 ball FBGA
18.75mm
4Gb 4Gb
B-die
8
2
78 ball FBGA
18.75mm
Org.
Density
Part Number
Speed
Raw Card
Composition
256Mx 72
2GB
M390B5773DH0
YH9
J(1Rx8)
256M x 8 * 9pcs
2Gb
512Mx 72
4GB
M390B5273DH0
YH9
K(2Rx8)
256M x 8 * 18 pcs
M390B5173BH0
YH9
J(1Rx8)
256M x 8 * 18 pcs
M390B1G73BH0
YH9
K(2Rx8)
512M x 8 * 18 pcs
1Gx 72
8GB
NOTE
Now Now Now
*GNOTE : 1.35V product is 1.5V operatable.
4.4 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org.
Density
256Mx 64
2GB
512Mx 64
1Gx 64
4GB
8GB
Part Number
Speed
M471B5773CHS
CF8/H9/K0
M471B5773DH0
CF8/H9/K0
M471B5273CH0
CF8/H9/K0
M471B5273DH0
CF8/H9/K0
M471B5273EB0
CH9/K0
M471B5173CB0
CK0
M471B5173DB0
CH9/K0
M471B1G73BH0
CH9/K0
M471B1G73CB0
CK0
M471B1G73DB0
CH9/K0
Raw Card
256M x 8 * 8 pcs B(1Rx8)
F(2Rx8)
B(1Rx8)
F(2Rx8)
Comp. Version
Composition
2Gb
Internal Banks
Rank
PKG
Height
8
1
78 ball FBGA
30mm
C-die
256M x 8 * 8 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
C-die
256M x 8 * 16 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
E-die
512M x 8 * 8 pcs
4Gb
C-die
512M x 8 * 8 pcs
4Gb
D-die
512M x 8 * 16 pcs
4Gb
B-die
512M x 8 * 16 pcs
4Gb
C-die
512M x 8 * 16 pcs
4Gb
D-die
Avail.
NOTE
Now Now Now
8
2
Now 78 ball FBGA
8
30mm
Now Now
1
1Q’13 Now 8
2
78 ball FBGA
30mm
Now 1Q’13
4.5 204Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org.
Density
256Mx 64
2GB
512Mx 64
1Gx 64
4GB
8GB
Part Number
Speed
M471B5773CHS
YF8/H9
M471B5773DH0
YF8/H9/K0
M471B5273CH0
YF8/H9
M471B5273DH0
YF8/H9/K0
M471B5273EB0
YK0
M471B5173CB0
YH9/K0
Raw Card B(1Rx8)
F(2Rx8)
B(1Rx8)
Composition
Comp. Version
256M x 8 * 8 pcs
2Gb
C-die
256M x 8 * 8 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
C-die
256M x 8 * 16 pcs
2Gb
D-die
256M x 8 * 16 pcs
2Gb
E-die
512M x 8 * 8 pcs
4Gb
C-die
M471B5173DB0
YH9/K0
512M x 8 * 8 pcs
4Gb
D-die
M471B1G73BH0
YF8/H9/K0
512M x 8 * 16 pcs
4Gb
B-die
M471B1G73CB0
YH9/K0
512M x 8 * 16 pcs
4Gb
C-die
M471B1G73DB0
YH9/K0
512M x 8 * 16 pcs
4Gb
D-die
F(2Rx8)
*GNOTE : 1.35V product is 1.5V operatable.
-6-
Internal Banks
Rank
PKG
Height
8
1
78 ball FBGA
30mm
8
2
Avail. Now Now Now Now
78 ball FBGA 8
30mm
Now Now
1
4Q’12 Now 8
2
78 ball FBGA
30mm
Now 4Q’12
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.6 204Pin DDR3 ECC SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
D-die
8
1
78 ball FBGA
30mm
Now
2Gb
D-die
8
2
78 ball FBGA
30mm
Now
256M x 8 * 18 pcs
2Gb
B-die
8
1
78 ball FBGA
30mm
Now
512M x 8 * 18 pcs
4Gb
B-die
8
2
78 ball FBGA
30mm
Now
Org.
Density
Part Number
Speed
Raw Card
Composition
256Mx 72
2GB
M474B5773DH0
YF8/H9
C(1Rx8)
256M x 8 * 9 pcs
2Gb
M474B5273DH0
YF8/H9
D(2Rx8)
256M x 8 * 18 pcs
512Mx 72
4GB M474B5173BH0
YF8/H9/K0
C(1Rx8)
M474B1G73BH0
YF8/H9/K0
D(2Rx8)
1Gx 72
8GB
NOTE
GNOTE : 1.35V product is 1.5V operatable.
4.7 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Comp. Version
Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
1Gb
G-die
8
2
1Gb
G-die
8
1
8
1
Org.
Density
Part Number
Speed
Raw Card
Composition
128Mx 72
1GB
M393B2873GB0
CH9/K0/MA
A(1Rx8)
128M x 8 * 9 pcs
1Gb
M393B5673GB0
CH9/K0/MA
B(2Rx8)
128M x 8 * 18 pcs
M393B5670GB0
CH9/K0/MA
C(1Rx4)
256M x 4 * 18 pcs
256Mx 72
512Mx 72
1Gx 72
2Gx 72
2GB
4GB
8GB
16GB
M393B5773CH0
CF8/H9/K0
M393B5773DH0
CH9/K0/MA
M393B5173GB0
CH9
M393B5170GB0
CH9/K0/MA
Now 78 ball FBGA
30mm
Now
256M x 8 * 9 pcs
2Gb
C-die
256M x 8 * 9 pcs
2Gb
D-die
H(4Rx8)
128M x 8 * 36 pcs
1Gb
G-die
8
4
Now
E(2Rx4)
256M x 4 * 36 pcs
1Gb
G-die
8
2
Now
256M x 8 * 18 pcs
2Gb
C-die
B(2Rx8)
256M x 8 * 18 pcs
2Gb
D-die
8
2
A(1Rx8)
M393B5273CH0
CF8/H9/K0
M393B5273DH0
CH9/K0/MA
M393B5273EB0
CMA
256M x 8 * 18 pcs
2Gb
E-die
M393B5270CH0
CH9/K0
512M x 4 * 18 pcs
2Gb
C-die
M393B5270DH0
CH9/K0/MA
512M x 4 * 18 pcs
2Gb
D-die
M393B5270EB0
CH9/MA
512M x 4 * 18 pcs
2Gb
E-die
M393B1K73CH0
CF8/H9
M393B1K73DH0
CH9
C(1Rx4)
H(4Rx8)
256M x 8 * 36 pcs
2Gb
C-die
256M x 8 * 36 pcs
2Gb
D-die
M393B1K73EB0
CH9
256M x 8 * 36 pcs
2Gb
E-die
M393B1K70CH0
CF8/H9/K0
512M x 4 * 36 pcs
2Gb
C-die
M393B1K70DH0
CH9/K0/MA
512M x 4 * 36 pcs
2Gb
D-die
M393B1K70EB0
CH9/MA
512M x 4 * 36 pcs
2Gb
E-die
E(2Rx4)
Now Now
Now 78 ball FBGA
30mm
Now Now Now
8
1
Now Now Now
8
4
Now Now
8
2
78 ball FBGA
30mm
Now Now Now
M393B1G73BH0
CH9/K0/MA
B(2Rx8)
512M x 8 * 18 pcs
4Gb
B-die
M393B1G70BH0
CH9/K0/MA
C(1Rx4)
1G x 4 * 18 pcs
4Gb
B-die
8
1
Now
M393B2K70DM0
CF8/H9
AB(4Rx4)
1G x 4 * 36 pcs DDP
2Gb
D-die
8
4
Now
M393B2G70BH0
CF8/H9
1G x 4 * 36 pcs
4Gb
B-die 8
2
E(2Rx4)
Now
78 ball FBGA
Now 30mm
M393B2G70CB0
CK0/MA
1G x 4 * 36 pcs
4Gb
C-die
M393B2G73BH0
CF8/H9
H(4Rx8)
512M x 8 * 36 pcs
4Gb
B-die
8
4
Now
M393B2G70DB0
CK0/MA
E(2Rx4)
1G x 4 * 36 pcs
4Gb
D-die
8
2
1Q’13
-7-
Now
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.8 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
30mm
Now
1Gb
G-die
8
2
Now
1Gb
G-die
8
1
Now
2Gb
C-die 8
1
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M393B2873GB0
YF8/H9/K0
A(1Rx8)
128M x 8 *
9 pcs
1Gb
M393B5673GB0
YF8/H9/K0
B(2Rx8)
128M x 8 * 18 pcs
M393B5670GB0
YF8/H9/K0
C(1Rx4)
256M x 4 * 18 pcs
M393B5773CH0
YF8/H9
256M x 8 *
256Mx 72
2GB
M393B5773DH0
512Mx 72
1Gx 72
2Gx 72
4Gx 72
4GB
8GB
16GB
32GB
YF8/H9/K0
A(1Rx8)
Composition
Comp. Version
Org.
256M x 8 *
9 pcs 9 pcs
2Gb
D-die
78 ball FBGA
30mm
Now Now
M393B5173GB0
YF8/H9
H(4Rx8)
128M x 8 * 36 pcs
1Gb
G-die
8
4
Now
M393B5170GB0
YF8/H9/K0
E(2Rx4)
256M x 4 * 36 pcs
1Gb
G-die
8
2
Now
256M x 8 * 18 pcs
2Gb
C-die
B(2Rx8)
256M x 8 * 18 pcs
2Gb
D-die
8
2
Now
M393B5273CH0
YF8/H9
M393B5273DH0
YF8/H9/K0
M393B5273EB0
YH9/K0
256M x 8 * 18 pcs
2Gb
E-die
M393B5270CH0
YF8/H9
512M x 4 * 18 pcs
2Gb
C-die
M393B5270DH0
YF8/H9/K0
512M x 4 * 18 pcs
2Gb
D-die
M393B5270EB0
YH9/K0
512M x 4 * 18 pcs
2Gb
E-die
M393B1K73CH0
YF8/H9
M393B1K73DH0
YF8/H9
C(1Rx4)
H(4Rx8)
256M x 8 * 36 pcs
2Gb
C-die
256M x 8 * 36 pcs
2Gb
D-die
M393B1K73EB0
YH9
256M x 8 * 36 pcs
2Gb
E-die
M393B1K70CH0
YF8/H9
512M x 4 * 36 pcs
2Gb
C-die
M393B1K70DH0
YF8/H9/K0
512M x 4 * 36 pcs
2Gb
D-die
M393B1K70EB0
YH9/K0
512M x 4 * 36 pcs
2Gb
E-die
E(2Rx4)
Now 78 ball FBGA
30mm
Now Now
8
1
Now Now Now
8
4
Now Now
8
2
78 ball FBGA
30mm
Now Now Now
M393B1G73BH0
YF8/H9/K0
B(2Rx8)
512M x 8 * 18 pcs
4Gb
B-die
8
2
Now
M393B1G70BH0
YF8/H9/K0
C(1Rx4)
1G x 4 * 18 pcs
4Gb
B-die
8
1
Now
M393B2K70DM0
YF8/H9
AB(4Rx4)
1G x 4 * 36 pcs DDP
2Gb
D-die
8
4
Now
M393B2G70BH0
YF8/H9/K0
M393B2G70CB0
YH9/K0
8
2
M393B2G70DB0
YH9/K0
M393B2G73BH0
YF8/H9
M393B4G70BM0
YF8/H9
1G x 4 * 36 pcs
4Gb
B-die
1G x 4 * 36 pcs
4Gb
C-die
1G x 4 * 36 pcs
4Gb
D-die
H(4Rx8)
512M x 8 * 36 pcs
4Gb
B-die
AB(4Rx4)
2G x 4 * 36 pcs DDP
E(2Rx4)
*GNOTE : 1.35V product is 1.5V operatable.
-8-
4Gb
B-die
78 ball FBGA
Now 30mm
Now 1Q’13
8 8
4 4
Now 78 ball FBGA
30mm
Now
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.9 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Internal Banks
Rank
PKG
Height
Avail.
G-die
8
1
78 ball FBGA
18.75mm
Now
1Gb
G-die
8
2
1Gb
G-die
9 pcs
2Gb
C-die
8
1
9 pcs
2Gb
D-die
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M392B2873GB0
CF8/H9/K0/MA
K(1Rx8)
128M x 8 *
9 pcs
1Gb
M392B5673GB0
CF8/H9/K0/MA
L(2Rx8)
128M x 8 * 18 pcs
M392B5670GB0
CF8/H9/K0/MA
M(1Rx4)
256M x 4 * 18 pcs
M392B5773CH0
CF8/H9/K0
256M x 8 *
M392B5773DH0
CF8/H9/K0/MA
256M x 8 *
256Mx 72
512Mx 72
2GB
4GB
M392B5273CH0
CF8/H9/K0
M392B5273DH0
CF8/H9/K0/MA
M392B5270CH0
CF8/H9/K0
M392B5270DH0
CF8/H9/K0/MA
M392B1K73CM0
CF8/H9
K(1Rx8)
L(2Rx8)
M(1Rx4)
V(4Rx8)
1Gx 72
8GB
4Gx 72
2Gb
C-die
2Gb
D-die
512M x 4 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
D-die
512M x 8 * 18 pcs DDP
2Gb
C-die
512M x 8 * 18 pcs DDP
2Gb
D-die
M392B1K70CM0
CF8/H9/K0
1G x 4 * 18 pcs DDP
2Gb
C-die
1G x 4 * 18 pcs DDP
2Gb
D-die
8
8
Now 4 Now 78 ball FBGA
1
B-die
8
2
L(2Rx8)
512M x8 * 18 pcs
4Gb
B-die
CF8/H9/K0/MA
M(1Rx4)
1G x4 * 18 pcs
4Gb
M392B2G70BM0
CF8/H9/K0/MA
N(2Rx4)
2G x4 * 18 pcs DDP
4Gb
18.75mm
Now Now Now
M392B2G73BM0
CF8/H9
V(4Rx8)
1G x8 * 18 pcs DDP
4Gb
B-die
8
4
M392B4G70BE0
CF8/H9
U(4Rx4)
4G * x4 18 pcs QDP
4Gb
B-die
8
4
-9-
Now Now
8
CF8/H9/K0/MA
M392B1G70BH0
Now Now
Now 18.75mm
1
B-die
M392B1G73BH0
18.75mm
Now 78 ball FBGA
2
CF8/H9/K0/MA
78 ball FBGA
2
8
M392B1K70DM0
Now
Now
8
CF8/H9
16GB
32GB
256M x 8 * 18 pcs 256M x 8 * 18 pcs
M392B1K73DM0
N(2Rx4)
2Gx 72
Composition
Comp. Version
Org.
Now 78 ball FBGA
Now 18.75mm Now
78 ball FBGA
18.75mm
Now
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.10 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Internal Banks
Rank
G-die
8
1
1Gb
G-die
8
2
1Gb
G-die
8
1
512M x 4 * 9 pcs
2Gb
C-die
512M x 4 * 9 pcs
2Gb
D-die
8
1
256M x 8 * 18 pcs
2Gb
C-die
256M x 8 * 18 pcs
2Gb
D-die
8
2
512M x 4 * 18 pcs
2Gb
C-die
512M x 4 * 18 pcs
2Gb
D-die
512M x 8 * 18 pcs DDP
2Gb
C-die
Density
Part Number
Speed
Raw Card
128Mx 72
1GB
M392B2873GB0
YF8/H9/K0
K(1Rx8)
128M x 8 * 9 pcs
1Gb
M392B5673GB0
YF8/H9/K0
L(2Rx8)
128M x 8 * 18 pcs
M392B5670GB0
YF8/H9/K0
M(1Rx4)
256M x 4 * 18 pcs
M392B5773CH0
YF8/H9
M392B5773DH0
YF8/H9/K0
256Mx 72
512Mx 72
2GB
4GB
M392B5273CH0
YF8/H9
M392B5273DH0
YF8/H9/K0
M392B5270CH0
YF8/H9
M392B5270DH0
YF8/H9/K0
M392B1K73CM0
YF8/H9
K(1Rx8)
L(2Rx8)
M(1Rx4)
V(4Rx8)
1Gx 72
8GB
YF8/H9
512M x 8 * 18 pcs DDP
2Gb
D-die
M392B1K70CM0
YF8/H9
1G x 4 * 18 pcs DDP
2Gb
C-die
1G x 4 * 18 pcs DDP
2Gb
D-die
4Gx 72
Height
78 ball 18.75mm FBGA
8
Avail. Now Now
78 ball 18.75mm FBGA
Now Now Now Now
1
Now Now Now Now
4 Now
8
2
78 ball 18.75mm FBGA
Now
M392B1K70DM0
YF8/H9/K0
M392B1G73BH0
YF8/H9/K0
L(2Rx8)
512M x 8 * 18 pcs
4Gb
B-die
8
2
Now
M392B1G70BH0
YF8/H9/K0
M(1Rx4)
1G x 4 * 18 pcs
4Gb
B-die
8
1
Now
M392B2G70BM0
YF8/H9/K0
N(2Rx4)
2G x4 * 18 pcs DDP
4Gb
B-die
8
2
M392B2G73BM0
YF8/H9
V(4Rx8)
1G x8 * 18 pcs DDP
4Gb
B-die
8
4
M392B4G70BE0
YF8/H9
U(4Rx4)
4G x4 * 18 pcs QDP
4Gb
B-die
8
4
16GB
32GB
PKG
78 ball 18.75mm FBGA
8
M392B1K73DM0
N(2Rx4)
2Gx 72
Composition
Comp. Version
Org.
*GNOTE : 1.35V product is 1.5V operatable.
- 10 -
Now
78 ball 18.75mm FBGA 78 ball 18.75mm FBGA
Now Now Now
NOTE
Dec. 2012
Product Guide
DDR3 SDRAM Memory
4.11 240Pin DDR3 LRDIMM (1.5V Product) 240Pin DDR3 LDIMM Org.
4G x 72
8G x 72
Density
Part Number
Speed
M386B4G70BM0
CMA
32GB
64GB
Raw Card
2G x 4 * 36 pcs DDP C(4Rx4)
M386B4G70DM0
CMA
M386B8G70BO0
CK0
Composition
E(8Rx4)
Comp. Version 4Gb
Internal Banks
Rank
8
4
B-die
2G x 4 * 36 pcs DDP
4Gb
D-die
4G x 4 * 36 pcs QDP
4Gb
B-die
PKG
Height
78 ball 30.35mm FBGA
Avail. Now 2Q’13
78 ball 30.35mm FBGA
8
8
Internal Banks
Rank
8
4
78 ball 30.35mm FBGA
8
4
78 ball 30.35mm FBGA
NOTE
1)
Now
* NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.
4.12 240Pin DDR3 LRDIMM (1.35V Product) 240Pin DDR3 LDIMM Org.
Density
Part Number
Speed
2G x 72
16GB
M386B2G70DM0
YH9/K0
M386B4G70BM0
YH9/K0
4G x 72
8G x 72
Raw Card
C(4Rx4)
32GB
64GB
M386B4G70DM0
YH9/K0
M386B8G70BO0
YF8/H9
E(8Rx4)
Composition
Comp. Version
1G x 4 * 36 pcs DDP
2Gb
D-die
2G x 4 * 36 pcs DDP
4Gb
B-die
2G x 4 * 36 pcs DDP
4Gb
D-die
4G x 4 * 36 pcs QDP
4Gb
B-die
* NOTE 1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.
- 11 -
8
8
PKG
Height
78 ball 30.35mm FBGA
Avail.
NOTE
Now Now 1) 2Q’13 Now
Dec. 2012
Product Guide
DDR3 SDRAM Memory
5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example
4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2
Made in Korea
M393B5270DH0-CK0
1102
5.3 RCD Information - Example JEDEC Description
PKG
RCD Vendor
RCD Version(Rev.)
1Gb F-die 2Gb C-die 4Gb A-die
IDT
HLB(B0)
D2
Inphi
GS04(1.5V)/LV-GS02(1.35V)
P1
IDT
A1(evergreen)
D3
Inphi
UV-GS02
P2
IDT
B1
D4
Inphi
XV-GS02
P3
1Gb G-die 2Gb D-die 4Gb B-die 2Gb E-die 2Gb E-die 4Gb C-die 4Gb D-die
(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)
* NOTE 1) PC3L is used for 1.35V 2) RCD information is subject to change.
- 12 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
6. LRDIMM Memory Buffer Information 6.1 Label Example
32GB 4Rx4 PC3L - 10600L - 09 - 11 - C0
Made in Korea
M386B4G70BM0-YH90 1102
6.2 Memory Buffer Information - Example Voltage
Vendor
Revision
Module P/N
JEDEC Description On Label
Inphi
iMB02-GS02A
M386B4G70BM0-YH901
32GB 4Rx4 PC3L-10600L-09-11-C0
Montage
MB C0
M386B4G70BM0-YH921
32GB 4Rx4 PC3L-10600L-09-11-C0
Inphi
iMB02-GS02A
M386B4G70BM0-CMA31
32GB 4Rx4 PC3-14900L-13-11-C0
IDT
A2
M386B4G70BM0-CMA11
32GB 4Rx4 PC3-14900L-13-11-C0
Montage
MB C1
M386B4G70BM0-CMA41
32GB 4Rx4 PC3-14900L-13-11-C0
1.35V
1.5V
* NOTE 1) The 16th digit refers memory buffer vendor and revision. 0: Inphi iMB02-GS02A 1: IDT A2 2: Montage MB C0 3: Inphi iMB02-GS02B 4: Montage MB C1 2) Memory buffer information is subject to change.
- 13 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
7. Package Dimension
A
0.80 x 8 = 6.40 0.80 1.60
#A1 INDEX MARK
3.20
#A1
11.00 r 0.10
0.80 x12 = 9.60
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
7.50 r0.10
B
9 8 7 6 5 4 3 2 1
11.00 r 0.10
(Datum A)
0.50 r 0.05
7.50 r0.10
0.10MAX
78Ball FBGA for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)
78 - 0.45 Solder ball (Post Reflow 0.05 r 0.05)
0.35 r0.05
(0.95)
1.10 r0.10
MOLDING AREA (1.90)
0.2 M A B
BOTTOM VIEW
TOP VIEW
7.50 r0.10
0.80 x 8 6.40 0.80
(Datum A)
1.60
A #A1 INDEX MARK
3.20
#A1
11.00 r 0.10
11.00 r 0.10
0.80 x12 = 9.60
4.80 0.80 0.80
(Datum B)
7.50 r0.10
B
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
0.10MAX
78Ball FBGA Flip chip for 2Gb E-die (x4/x8)
78 - 0.48 Solder ball (Post Reflow 0.50 r 0.05)
0.37 r0.05
(0.30) (0.60)
1.10 r0.10
MOLDING AREA
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 14 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
8.00 r0.10
0.10MAX
78Ball DDP for 2Gb C-die (x4/x8)
A
0.80 x 8 = 6.40 (Datum A)
0.80
1.60
#A1 INDEX MARK
3.20
#A1 9 8 7 6 5 4 3 2 1
11.00 r 0.10
11.00 r 0.10
0.80 x12 = 9.60
0.80
0.80
4.80
A B C (Datum B) D E F G H J K L M N
8.00 r0.10
B
0.35 r0.05
78 - 0.45 Solder ball (Post Reflow 0.50 r 0.05)
1.40 r0.10
0.2 M A B
TOP VIEW
BOTTOM VIEW
7.50 r0.10
0.80 x 8 6.40 0.80
(Datum A)
1.60
A #A1 INDEX MARK
3.20
#A1
11.00 r 0.10
11.00 r 0.10
0.80 x12 = 9.60
4.80 0.80 0.80
(Datum B)
7.50 r0.10
B
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
0.10MAX
78Ball DDP for 2Gb D-die (x4/x8)
0.35 r0.05
78 - 0.45 Solder ball (Post Reflow 0.50 r 0.05)
1.10 r0.10
0.2 M A B
TOP VIEW
BOTTOM VIEW
- 15 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
78Ball DDP for 4Gb A-die (x4/x8) A
0.10MAX
10.50 r 0.10 0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60 B
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
0.80 x12 = 9.60
9 8 7 6 5 4 3 2 1
#A1
10.50 r0.10
12.00 r0.10
0.80
12.00 r0.10
(Datum A)
78 - 0.45 r0.05Solder ball (Post Reflow 0.50 r 0.05)
0.35 r0.05 1.10 r0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
78Ball DDP for 4Gb B-die (x4/x8) A
0.10MAX
11.00 r 0.10 0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60 B
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
0.80 x12 = 9.60
9 8 7 6 5 4 3 2 1
#A1
11.00 r0.10
11.00 r0.10
0.80
11.00 r0.10
(Datum A)
78 - 0.45 r0.05 Solder ball (Post Reflow 0.50 r 0.05)
0.35 r0.05 1.10 r0.10
0.2 M A B
BOTTOM VIEW
TOP VIEW
- 16 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 4Gb B-die (x4/x8) 10.00 r 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60
4.80 0.80
10.00 r0.10
0.80
(Datum B)
0.80 x12 = 9.60
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
#A1
B
11.00 r0.10
0.80
11.00 r0.10
(Datum A)
78 - 0.45 Solder ball (Post Reflow 0.50 r 0.05)
0.35 r0.05
(0.95)
0.2 M A B
MOLDING AREA
1.10 r0.10
(1.90)
BOTTOM VIEW
TOP VIEW
78Ball FBGA for 4Gb C-die (x4/x8) 8.50 r 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60
78 - 0.48 Solder ball (Post Reflow 0.50 r 0.05)
A’
0.80 x12 = 9.60
4.80 0.80 A
8.50 r0.10
0.80
(Datum B)
A B C D E F G H J K L M N
#A1
B
9 8 7 6 5 4 3 2 1
11.00 r0.10
0.80
11.00 r0.10
(Datum A)
0.37 r0.05
(0.30) (0.60)
MOLDING AREA
1.10 r0.10
0.20 M A B
BOTTOM VIEW
TOP VIEW
- 17 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 4Gb D-die (x4/x8) 7.50 r 0.10
0.10MAX
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK
1.60 B
4.80 0.80 A
A’
7.50 r0.10
0.80
(Datum B)
0.80 x12 = 9.60
9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N
#A1
11.00 r0.10
0.80
11.00 r0.10
(Datum A)
78 - 0.48 Solder ball (Post Reflow 0.50 r 0.05)
0.37 r0.05
(0.30) (0.60)
MOLDING AREA
1.10 r0.10
0.20 M A B
TOP VIEW
BOTTOM VIEW
A
0.80 x 8 = 6.40 3.20
#A1 INDEX MARK #A1
78 - 0.48 Solder ball (Post Reflow 0.05 r 0.05) 0.2 M A B
0.80 x12 = 9.60
4.80 0.80 0.80
(Datum B)
A B C D E F G H J K L M N
7.50 r0.10
B
9 8 7 6 5 4 3 2 1
11.00 r 0.10
0.80 1.60
11.00 r 0.10
(Datum A)
0.50 r 0.05
7.50 r0.10
0.10MAX
78Ball FBGA Flip chip for 1Gb G-die (x4/x8)
0.35 r0.05
(0.30)
1.10 r0.10
MOLDING AREA (0.60)
Top
Bottom
- 18 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
8. Module Dimension x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
128.95
9.50
N/A (for x64)
SPD
17.30
ECC
2.30
(for x72)
30.00 ± 0.15
(4X)3.00 ± 0.1
133.35 ± 0.15
(2) 2.50 54.675 A
B
47.00
Max 4.0
71.00
N/A (for x64)
ECC (for x72)
2.50 ± 0.20
1.270 ± 0.10
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10 1.00 2.50
Detail A
Detail B
- 19 -
2x 2.10 ± 0.15
Dec. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM ECC VLP UDIMM
Units : Millimeters
133.35 ± 0.15 Max 4.0
18.75 ± 0.15
128.95
SPD/TS
54.675 1.0 max
A
B
D
47.00
1.27 ± 0.10
71.00
2.50 ± 0.20
C
5.00
2x 2.10 ± 0.15 0.80 ± 0.05
3.80
0.2 ± 0.15
1.50±0.10 1.00 2.50
Detail A
Detail B
- 20 -
(2)xR0.8
Detail C & D
Dec. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x64 204pin DDR3 SDRAM Unbuffered SODIMM 67.60 ± 0.13
63.60
6
20.00
SPD
30.00 ± 0.13
Max 3.8
1.00 ± 0.10 24.80
A 21.00
B 39.00
2X 1.80 0.10 M C A B (OPTIONAL HOLES)
2X 4.00 ± 0.10 0.10 M C A B
0.60 0.45 ± 0.03 1.65
4.00 ± 0.10
2.55
0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 21 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x72 204 pin DDR3 SDRAM ECC Unbuffered SODIMM 67.60 ± 0.13
63.60
6
20.00
30.00 ± 0.13
Max 3.8
1.00 ± 0.10 24.80
A
B 39.00
21.00 SPD
2X 1.80 0.10 M C A B (OPTIONAL HOLES)
2X 4.00 ± 0.10 0.10 M C A B
0.60 0.45 ± 0.03 1.65
4.00 ± 0.10
2.55
0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 22 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM Registered DIMM Units : Millimeters C
128.95 32.40
18.93
9.74
Max 4.0
2.30
2.50 54.675
A
1.0 max
B
47.00
1.27 ± 0.10
2.50 ± 0.20
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
1.00
10.9
R
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Register
2.50
17.30
Register
30.00 ± 0.15
18.92
0. 50
10.9
9.50
9.76
(2X)3.00
133.35 ± 0.15
Address, Command and Control lines
- 23 -
0.4
Dec. 2012
Product Guide
DDR3 SDRAM Memory
Registered DIMM Heat Spreader Design 1. FRONT PART Outside
R0.2
4.65± 0.12
2
2
2 ± 0.1
2.6 ± 0.2
0.4
Inside Green Line : TIM Attatch Line
7.45
Reg. pedestal line
80.78 119.29 128.5
2. BACK PART Outside
Inside
0.15 1.3
Green Line : TIM Attatch Line
- 24 -
1.3
1 0. R
127 ± 0.12
25.6 ± 0.15
31.4
23.6 ± 0.15
11.9
29.77
1
25.6 ± 0.15
0.65 ± 0.2
130.45 ± 0.15
9.26
1+0/ -0.3
133.15 ± 0.2
Dec. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART 39.3 ± 0.2 Upper Bending Tilting Gap
29.77
6.3± 0.12
5 1. R
7.3 ± 0.1
44.4
0.1 ~ 0.3
0.5
4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : 7.55mm (With Clip thickness)
3.77
1.27
133.15
7.3 ± 0.1
19 ± 0.12
19 ± 0.12
39.3 ± 0.2
D text mark ’D’ punch press_stamp
- 25 -
Clip open size 2.6~3.8
Dec. 2012
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP Registered DIMM
Units : Millimeters 133.35 ± 0.15 128.95 C 20.92
32.40
20.93
Max 4.0 9.74
Register
18.75 ± 0.15
9.76
54.675 A
B
12.60
47.00
1.0 max
71.00
1.27 ± 0.10 SPD/TS
2.50 ± 0.20
18.10
0.80 ± 0.05 9.9
3.80
0.6
5.00
0. 50
0.2 ± 0.15
1.50±0.10
R
1.00 2.50
Detail B
Detail C
VTT
Register
VTT
Detail A
VTT
VTT
SPD/TS
Address, Command and Control lines
- 26 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design (DDP) 1. FRONT PART Outside 130.45 67 20.82
35.98
20.82
8.69
14.3
0.4
8.69
Driver IC(DP:0.18mm)
Inside
Driver IC(DP:0.18mm)
2. BACK PART Outside
Driver IC(DP:0.18mm)
Inside
Driver IC(DP:0.18mm)
- 27 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
35.82
9.16 ± 0.12
7.2 ± 0.1
9.16
9.16 ± 0.12
7.2 ± 0.1
Clip open size 3.0~4.3
SIDE-L
0.1
FRONT
SIDE-R
4. ASS’Y VIEW
7.55
Reference thickness total (Maximum) : 7.55 (With Clip thickness)
TIM Thickness 0.25
- 28 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design (QDP) 1. FRONT PART Outside
127 ± 0.12 51.97 36.56 21.15
9.07
9.07
9.07
9.07
Caution "Hot surfoce"
11.6
51.95
Inside
2. BACK PART
Outside
Inside
- 29 -
13.6±0.15
9
Dec. 2012
Product Guide
DDR3 SDRAM Memory
3. CLIP PART 36.82 ± 0.12
Clip open size 3.85 ± 0.65
SIDE-L
7.40 ± 0.1
9.16
9.16 ± 0.12
9.16
7.40 ± 0.1
QU 0.40 ± 0.05
FRONT
SIDE-R
4. ASS’Y VIEW
8
Reference thickness total (Maximum) : 8 (With Clip thickness)
TIM Thickness 0.25
- 30 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x72 240pin DDR3 SDRAM LRDIMM
Max 4.8
2.30
2.50
17.30
9.50
30.35 ± 0.15
C
(2X)3.00
133.35 ± 0.15
54.675
1.27
B
A 47.00
2.50 ± 0.20
71.00
0.80 ± 0.05 9.9
3.80
0.6
5.00
0. 50
0.2 ± 0.15
1.50±0.10
R
1.00 2.50
Detail C
VTT VTT
VTT
VTT
VTT
Detail B
VTT
Detail A
VTT
VTT
MB
Address, Command and Control lines
- 31 -
Dec. 2012
Product Guide
DDR3 SDRAM Memory Units : Millimeters
x72 244pin DDR3 SDRAM Mini DIMM
82.00 ± 0.15
78.00 ± 0.1
33.60
38.40
1.80 ± 0.075
3.20
75.60
A
2.55± 0.20
6.00
17.90 ± 0.15
SPD
B Max 4.0
2.55 ± 0.20
1.270 ± 0.10
3.60 2.30 1.30
0.45 ± 0.03
3.80±0.10
0.25 ± 0.15
1.00±0.10 0.60
Detail A
Detail B
- 32 -
2x 2.00 ± 0.15